ISBN: 9783030934415
This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder mat… Mehr…
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2022, ISBN: 9783030934415
Springer, Kindle Ausgabe, 551 Seiten, Publiziert: 2022-03-01T00:00:00.000Z, Produktgruppe: Digital Ebook Purchas, Maschinenbau, Ingenieurwissenschaften, Fachbücher, Kategorien, Bücher, Ma… Mehr…
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2022, ISBN: 9783030934415
Editor: Salleh, Mohd Arif Anuar Mohd, Editor: Abdul Aziz, Mohd Sharizal, Editor: Jalar, Azman, Editor: Izwan Ramli, Mohd Izrul, Springer, Kindle Edition, 551 Seiten, Publiziert: 2022-03-0… Mehr…
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2022, ISBN: 9783030934415
Materials Development, Processing and Performances, eBooks, eBook Download (PDF), 1st ed. 2022, [PU: Springer International Publishing], Springer International Publishing, 2022
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2022, ISBN: 9783030934415
Materials Development, Processing and Performances, eBooks, eBook Download (PDF), Auflage, [PU: Springer-Verlag], Seiten: 328, [ED: 1], Springer-Verlag, 2022
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Recent Progress in Lead-Free Solder Technology: Materials Development, Processing and Performances Mohd Arif Anuar Mohd Salleh Editor - neues Buch
ISBN: 9783030934415
This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder mat… Mehr…
2022, ISBN: 9783030934415
Springer, Kindle Ausgabe, 551 Seiten, Publiziert: 2022-03-01T00:00:00.000Z, Produktgruppe: Digital Ebook Purchas, Maschinenbau, Ingenieurwissenschaften, Fachbücher, Kategorien, Bücher, Ma… Mehr…
2022
ISBN: 9783030934415
Editor: Salleh, Mohd Arif Anuar Mohd, Editor: Abdul Aziz, Mohd Sharizal, Editor: Jalar, Azman, Editor: Izwan Ramli, Mohd Izrul, Springer, Kindle Edition, 551 Seiten, Publiziert: 2022-03-0… Mehr…
2022, ISBN: 9783030934415
Materials Development, Processing and Performances, eBooks, eBook Download (PDF), 1st ed. 2022, [PU: Springer International Publishing], Springer International Publishing, 2022
2022, ISBN: 9783030934415
Materials Development, Processing and Performances, eBooks, eBook Download (PDF), Auflage, [PU: Springer-Verlag], Seiten: 328, [ED: 1], Springer-Verlag, 2022
Bibliographische Daten des bestpassenden Buches
Detailangaben zum Buch - Recent Progress in Lead-Free Solder Technology: Materials Development, Processing and Performances Mohd Arif Anuar Mohd Salleh Editor
EAN (ISBN-13): 9783030934415
Erscheinungsjahr: 2022
Herausgeber: Springer-Verlag New York, LLC Digital >16
Buch in der Datenbank seit 2022-05-09T17:16:43+02:00 (Vienna)
Buch zuletzt gefunden am 2024-06-30T02:28:19+02:00 (Vienna)
ISBN/EAN: 9783030934415
ISBN - alternative Schreibweisen:
978-3-030-93441-5
Alternative Schreibweisen und verwandte Suchbegriffe:
Autor des Buches: salleh, aziz
Daten vom Verlag:
Autor/in: Mohd Arif Anuar Mohd Salleh; Mohd Sharizal Abdul Aziz; Azman Jalar; Mohd Izrul Izwan Ramli
Titel: Topics in Mining, Metallurgy and Materials Engineering; Recent Progress in Lead-Free Solder Technology - Materials Development, Processing and Performances
Verlag: Springer; Springer International Publishing
328 Seiten
Erscheinungsjahr: 2022-03-01
Cham; CH
Sprache: Englisch
171,19 € (DE)
176,00 € (AT)
201,00 CHF (CH)
Available
XII, 328 p. 180 illus., 143 illus. in color.
EA; E107; eBook; Nonbooks, PBS / Technik/Maschinenbau, Fertigungstechnik; Materialwissenschaft; Verstehen; composite solder; intermetallic compound; electronic packaging; solder technology; laser soldering; B; Metals and Alloys; Chemistry and Materials Science; BB
This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.Comprehensive overview of current developments in the emerging field of Pb-free solder technology Examines various technologies involving rigid and flexible PCB Touches upon a vast array of special topics detailing the advanced characterization and modeling techniques
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