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Stress Analysis of Bonded Assemblies: Applications inMicroelectronics - Shakya Shilak
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ISBN: 9783639060324

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Axisymmetric Assemblies under Thermal Loading Four analytical models are developed for predicting the maximum shearing displacement in a bonded assembly under global thermal mismatch loading. Analytical model includes: i) elastic analysis, ii) elasto-plastic analysis, iii) viscoelastic analysis, and iv) viscoelastic-plastic analysis. All results have been derived as closed-form correction factors to be applied to the easily calculated unconstrained shear displacement to obtain the maximum shear displacement. The motivation for determining the maximum shear displacement is to compute the maximum shear strain, which is then used to estimate the cycles-to-failure by means of a fatigue law. The analytical relations derived are simple, easy-to-use, and helpful for studying the interaction among the various design parameters. The analytical relations are in good agreement with existing experimental and numerical results. Bücher / Fremdsprachige Bücher / Englische Bücher 978-3-639-06032-4, VDM

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Stress Analysis of Bonded Assemblies: Applications inMicroelectronics - Shakya Shilak
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Four analytical models are developed for predicting the maximum shearing displacement in a bonded assembly under global thermal mismatch loading. Analytical model includes: i) elastic analysis, ii) elasto-plastic analysis, iii) viscoelastic analysis, and iv) viscoelastic-plastic analysis. All results have been derived as closed-form correction factors to be applied to the easily calculated unconstrained shear displacement to obtain the maximum shear displacement. The motivation for determining the maximum shear displacement is to compute the maximum shear strain, which is then used to estimate the cycles-to-failure by means of a fatigue law. The analytical relations derived are simple, easy-to-use, and helpful for studying the interaction among the various design parameters. The analytical relations are in good agreement with existing experimental and numerical results. Axisymmetric Assemblies under Thermal Loading Buch (fremdspr.) Bücher>Fremdsprachige Bücher>Englische Bücher, VDM

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Stress Analysis of Bonded Assemblies: Applications in Microelectronics - Shilak Shakya
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ISBN: 9783639060324

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Four analytical models are developed for predictingthe maximum shearing displacement in a bondedassembly under global thermal mismatch loading.Analytical model includes: i) elastic analysis, ii)elasto-plastic analysis, iii) viscoelastic analysis,and iv) viscoelastic-plastic analysis.All results have been derived as closed-formcorrection factors to be applied to the easilycalculated unconstrained shear displacement to obtainthe maximum shear displacement. The motivation fordetermining the maximum shear displacement is tocompute the maximum shear strain, which is then usedto estimate the cycles-to-failure by means of afatigue law.The analytical relations derived are simple,easy-to-use, and helpful for studying the interactionamong the various design parameters. The analyticalrelations are in good agreement with existingexperimental and numerical results. Bücher / Naturwissenschaften, Medizin, Informatik & Technik / Technik, [PU: VDM Verlag Dr. Müller, Saarbrücken]

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Stress Analysis of Bonded Assemblies: Applications inMicroelectronics - Shakya, Shilak
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2008, ISBN: 9783639060324

[ED: Softcover], [PU: Vdm Verlag Dr. Müller], Four analytical models are developed for predicting the maximum shearing displacement in a bonded assembly under global thermal mismatch loading. Analytical model includes: i) elastic analysis, ii) elasto-plastic analysis, iii) viscoelastic analysis, and iv) viscoelastic-plastic analysis. All results have been derived as closed-form correction factors to be applied to the easily calculated unconstrained shear displacement to obtain the maximum shear displacement. The motivation for determining the maximum shear displacement is to compute the maximum shear strain, which is then used to estimate the cycles-to-failure by means of a fatigue law. The analytical relations derived are simple, easy-to-use, and helpful for studying the interaction among the various design parameters. The analytical relations are in good agreement with existing experimental and numerical results.2008. 256 p.Versandfertig in 3-5 Tagen, [SC: 0.00]

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Stress Analysis of Bonded Assemblies: Applications inMicroelectronics: Axisymmetric Assemblies under Thermal Loading - Shakya Shilak
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Stress Analysis of Bonded Assemblies: Applications inMicroelectronics: Axisymmetric Assemblies under Thermal Loading - Taschenbuch

ISBN: 3639060326

Taschenbuch, [EAN: 9783639060324], Vdm Verlag, Vdm Verlag, Book, [PU: Vdm Verlag], Vdm Verlag, 60525011, Elektronik, 60516011, Elektrotechnik, 60448011, Ingenieurwesen & Technik, 60447011, Architektur, Technik & Ingenieurswesen, 54071011, Genres, 52044011, Fremdsprachige Bücher, 56441011, Technologie, 56447011, Erneuerbare Energien, 56448011, Innovationen, 1320311031, Nachschlagewerke, 56444011, Nanotechnologie, 56449011, Philosophie der Technologie, 56445011, Risiken, 56446011, Sicherheit & Gesundheit, 273011011, Soziale Aspekte, 54518011, Technisches Denken & Schreiben, 56451011, Technologie & Gesellschaft, 56211011, Technologiegeschichte, 56442011, Zukunftsforschung, 56047011, Fachbücher, 54071011, Genres, 52044011, Fremdsprachige Bücher

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Stress Analysis of Bonded Assemblies: Applications inMicroelectronics

Four analytical models are developed for predicting the maximum shearing displacement in a bonded assembly under global thermal mismatch loading. Analytical model includes: i) elastic analysis, ii) elasto-plastic analysis, iii) viscoelastic analysis, and iv) viscoelastic-plastic analysis. All results have been derived as closed-form correction factors to be applied to the easily calculated unconstrained shear displacement to obtain the maximum shear displacement. The motivation for determining the maximum shear displacement is to compute the maximum shear strain, which is then used to estimate the cycles-to-failure by means of a fatigue law. The analytical relations derived are simple, easy-to-use, and helpful for studying the interaction among the various design parameters. The analytical relations are in good agreement with existing experimental and numerical results.

Detailangaben zum Buch - Stress Analysis of Bonded Assemblies: Applications inMicroelectronics


EAN (ISBN-13): 9783639060324
ISBN (ISBN-10): 3639060326
Gebundene Ausgabe
Taschenbuch
Erscheinungsjahr: 2008
Herausgeber: VDM Verlag
256 Seiten
Gewicht: 0,398 kg
Sprache: eng/Englisch

Buch in der Datenbank seit 25.08.2007 02:34:49
Buch zuletzt gefunden am 22.08.2017 14:29:55
ISBN/EAN: 9783639060324

ISBN - alternative Schreibweisen:
3-639-06032-6, 978-3-639-06032-4


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