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Advanced Packaging For Microelectronic andMicrosystem Applications - Travis Anderson
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Advanced Packaging For Microelectronic andMicrosystem Applications - neues Buch

2008, ISBN: 9783639096767

ID: 690905883

The emergence of GaN-based devices promises a revolution in areas requiring high performance electronics, such as high speed earth and space-based communication systems, advanced radar, integrated sensors, high temperature electronics, and utility power switching. The properties of this system make it ideally suited for operation at elevated temperatures and at voltage and current levels well beyond that accessible by Si. Recent improvements in material quality and device performance are rapidly opening the door to commercialization, and III-N technologies are demonstrating exciting developments of late. Though devices are entering commercialization, there are still considerable unknowns, particularly in the reliability field. Recent advances at the University of Florida will be detailed in this work. With Emphasis on GaN Technology Bücher > Sachbücher > Naturwissenschaften & Technik > Ingenieurwissenschaft & Technik Taschenbuch 01.11.2008, VDM, .200

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Advanced Packaging For Microelectronic and Microsystem Applications - With Emphasis on GaN Technology
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Advanced Packaging For Microelectronic and Microsystem Applications - With Emphasis on GaN Technology - Taschenbuch

2008, ISBN: 9783639096767

[ED: Taschenbuch / Paperback], [PU: VDM Verlag Dr. Müller], The emergence of GaN-based devices promises a revolution in areas requiring high performance electronics, such as high speed earth and space-based communication systems, advanced radar, integrated sensors, high temperature electronics, and utility power switching. The properties of this system make it ideally suited for operation at elevated temperatures and at voltage and current levels well beyond that accessible by Si. Recent improvements in material quality and device performance are rapidly opening the door to commercialization, and III-N technologies are demonstrating exciting developments of late. Though devices are entering commercialization, there are still considerable unknowns, particularly in the reliability field. Recent advances at the University of Florida will be detailed in this work., [SC: 0.00], Neuware, gewerbliches Angebot, [GW: 165g]

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Advanced Packaging For Microelectronic andMicrosystem Applications - Travis Anderson
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
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Travis Anderson:
Advanced Packaging For Microelectronic andMicrosystem Applications - neues Buch

ISBN: 9783639096767

ID: 836040295

The emergence of GaN-based devices promises a revolution in areas requiring high performance electronics, such as high speed earth and space-based communication systems, advanced radar, integrated sensors, high temperature electronics, and utility power switching. The properties of this system make it ideally suited for operation at elevated temperatures and at voltage and current levels well beyond that accessible by Si. Recent improvements in material quality and device performance are rapidly opening the door to commercialization, and III-N technologies are demonstrating exciting developments of late. Though devices are entering commercialization, there are still considerable unknowns, particularly in the reliability field. Recent advances at the University of Florida will be detailed in this work. With Emphasis on GaN Technology Buch (fremdspr.) Bücher>Sachbücher>Naturwissenschaften & Technik>Ingenieurwissenschaft & Technik, VDM

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Advanced Packaging For Microelectronic and Microsystem Applications - Travis Anderson
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
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Travis Anderson:
Advanced Packaging For Microelectronic and Microsystem Applications - neues Buch

ISBN: 9783639096767

ID: 689f8c81eda48e1114cf1ce9fb5b1898

The emergence of GaN-based devices promises arevolution in areas requiring high performanceelectronics, such as high speed earth and space-basedcommunication systems, advanced radar, integratedsensors, high temperature electronics, and utilitypower switching. The properties of this system makeit ideally suited for operation at elevatedtemperatures and at voltage and current levels wellbeyond that accessible by Si. Recent improvements inmaterial quality and device performance are rapidlyopening the door to commercialization, and III-Ntechnologies are demonstrating exciting developmentsof late. Though devices are enteringcommercialization, there are still considerableunknowns, particularly in the reliability field.Recent advances at the University of Florida will bedetailed in this work. Bücher / Naturwissenschaften, Medizin, Informatik & Technik / Technik, [PU: VDM Verlag Dr. Müller, Saarbrücken]

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Advanced Packaging For Microelectronic and Microsystem Applications - Travis Anderson
Vergriffenes Buch, derzeit bei uns nicht verfügbar.
(*)
Travis Anderson:
Advanced Packaging For Microelectronic and Microsystem Applications - neues Buch

ISBN: 9783639096767

ID: 689f8c81eda48e1114cf1ce9fb5b1898

The emergence of GaN-based devices promises a, [PU: VDM Verlag Dr. Müller, Saarbrücken]

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Advanced Packaging For Microelectronic andMicrosystem Applications

The emergence of GaN-based devices promises a revolution in areas requiring high performance electronics, such as high speed earth and space-based communication systems, advanced radar, integrated sensors, high temperature electronics, and utility power switching. The properties of this system make it ideally suited for operation at elevated temperatures and at voltage and current levels well beyond that accessible by Si. Recent improvements in material quality and device performance are rapidly opening the door to commercialization, and III-N technologies are demonstrating exciting developments of late. Though devices are entering commercialization, there are still considerable unknowns, particularly in the reliability field. Recent advances at the University of Florida will be detailed in this work.

Detailangaben zum Buch - Advanced Packaging For Microelectronic andMicrosystem Applications


EAN (ISBN-13): 9783639096767
ISBN (ISBN-10): 3639096762
Gebundene Ausgabe
Taschenbuch
Erscheinungsjahr: 2008
Herausgeber: VDM Verlag
116 Seiten
Gewicht: 0,189 kg
Sprache: ger/Deutsch

Buch in der Datenbank seit 15.12.2007 15:49:21
Buch zuletzt gefunden am 05.10.2017 18:42:42
ISBN/EAN: 9783639096767

ISBN - alternative Schreibweisen:
3-639-09676-2, 978-3-639-09676-7


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